Emtron Hybrids will metallize the following Substrate Types
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Alumina AL2O3
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91% to 99.6% (96% typical)
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0.010" to 0.100" thick
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Area up to 6" x 8"
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CO2 Laser processing allows any shape and size.
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99.5% Beryllia (BeO)
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Thermal conductivity second only to diamond among electrically
insulating materials, dissipating nearly 300 W/mK at room
temperature
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0.015" to 0.080" thick (.025, .040 and .060" typical)
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Area up to 4"x 4"
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Aluminum Nitride (AlN)
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0.020" to 0.040" thick (.025 and .040" typical)
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Area up to 4.500" x 4.500"
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Conducts heat almost as well as BeO, with lower toxicity
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Laser Processing
Standard Tolerance From Substrate Edge
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From to
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Scribe Line
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Hole Center
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Machined
Feature
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Scribed Edge
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± 3 mils
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± 3 mils
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± 3 mils
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Alignment Flat or Machined Edge
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± 1 mil
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± 1 mil
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± 1 mil
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As-Fired Edge
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± 10 mils
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± 10 mils
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± 10 mils
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Standard Internal Location Tolerance
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From to
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Scribe Line
Center
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Hole
Center
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Machined
Edge
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Scribed Line Center
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± 1 mil
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± 1 mil
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± 1 mil
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Hole Center Flat or Machined Edge
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± 1 mil
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± 1 mil
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± 1 mil
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Machined Edge
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± 1 mil
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± 1 mil
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± 1 mil
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Standard Hole Tolerance and Taper
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Material Thickness
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Tolerance
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Maximum Taper
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5-30 mils
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± 1 mil
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2 mils
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31-60 mils
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± 2 mils
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3 mils
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61-100 mils
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± 3 mils
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4 mils
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