Emtron Hybrids will metallize the following Substrate Types.

Alumina AL2O3

91% to 99.6%  (96% typical)

0.010" to 0.100" thick

Area up to 6" x 8"

CO2  Laser processing allows any shape and size.


99.5% Beryllia (BeO)

Thermal conductivity second only to diamond among electrically insulating materials, dissipating nearly 300 W/mK at room temperature

0.015" to 0.080" thick (.025, .040 and .060" typical)

Area up to 4"x 4"


Aluminum Nitride (AlN)

0.020" to 0.040" thick (.025 and .040" typical)

Area up to 4.500" x 4.500"

Conducts heat almost as well as BeO, with lower toxicity

Laser Processing

Standard Tolerance From Substrate Edge

From       to

Scribe Line

Hole Center

Machined Feature

Scribed Edge

± 3 mils

± 3 mils

± 3 mils

Alignment Flat or Machined Edge

± 1 mil

± 1 mil

± 1 mil

As-Fired Edge

± 10 mils

± 10 mils

± 10 mils

Standard Internal Location Tolerance

From       to

Scribe Line Center

Hole Center

Machined Edge

Scribed Line Center

± 1 mil

± 1 mil

± 1 mil

Hole Center Flat or Machined Edge

± 1 mil

± 1 mil

± 1 mil

Machined Edge

± 1 mil

± 1 mil

± 1 mil

Standard Hole Tolerance and Taper

Material Thickness

Tolerance

Maximum Taper

5-30 mils

± 1 mil

2 mils

31-60 mils

± 2 mils

3 mils

61-100 mils

± 3 mils

4 mils

As-Fired Substrate Tolerances and Characteristics

Composition

96% Al2O3

91% Al2O3

99.5% BeO

AlN

Manufacturer Part Number

Coors ADS-96R

NTK HA-96

Ceram Tek 708S

Kyocera A-476

Coors ADOS 90R

Brush Wellman 995

CBL 995

Toshiba K-170

Carborundum

Color

White

White

White

White

Dark Brown

nr

White

Ivory-Tan

nr

Surface Finish Micro inches)

<35

12 Ra

24 Ra

10-30 CLA

<45

15 CLA max.

<16

<32 Ra

nr

Grain Size (Microns)

4-7

nr

3-5

nr

5-7

9-16

10-20

nr

5-10

Length/Width Inches)

±1% NLT ±0.004

±0.8% NLT ±0.003

±1% NLT ±0.0039

±0.8% NLT ±0.004

±1% NLT ±0.004

±1% NLT ±0.004

±2%

±1% min. ±0.004

±0.005

Thickness (Inches)

±10% NLT ±0.0015

±10% NLT ±0.002

±10%

±10% NLT ±0.002

±10% NLT ±0.0015

±10% NLT ±0.003

±0.003

±10% min. ±0.002

±0.003

Camber (Inch per Inch)

±0.003

0.003

±0.4% of length

0.003

±0.003

0.004 NLT 0.002 TIR

0.003

nr

nr

Thermal Coeficient of Expansion (°C)

8.0x10-6 25-1000°C

7.7x10-7 25-700°C

8.0x10-6 20-1000°C

7.9x10-6 40-800°C

8.4x10-6 25-1000°C

9.0x10-6 25-1000°C

7.6x10-6 20-500°C

4.6x10-6

4.2x10-6 RT-400°C

Thermal Conductivity g-cal/sec xcm2xC/cm) [W/m-K]

[26] @20°C

0.057 @25°C

[24] 20-100°C

0.05 @20°C

[13] @20°C

0.6 @25°C

[255] @50°C

170

170-190

Flexural Strength (kpsi) [MPa]

58

47

[400]

40

53

35

[230]

[410]

[290]

Dielectric Constant @1MHz

9.5

9.5 (20°C)

9.8

9.4

10.3 (25°C)

6.5

6.36 (20°C)

8.6 (25°C)

8.9 RT

Loss Tangent @1MHz

0.0004

0.0003 (25°C)

0.0003

0.0019

0.005

0.0004 max

nr

0.0005 (25°C)

0.0005 RT

Document Date or Number

37-2-0893

OC-2085 (2)900

EL3GB 3.000 8930

003/001/9705

37-2-0893

CDDP-10 revC

3/1/92

AMD-100

A-12083

Please Note that this information is compiled for your convenience from the printed literature of the represented manufacturers. Emtron Hybrids cannot guarantee the accuracy of this information or that ceramic made by these manufacturers will meet these specifications.

Manufacturing From Prototype Thru Production. We Can Meet Your Deadline.