THICK FILM CAPABILITIES

CONDUCTORS
Au (Gold)
Pd/Au (Palladium/Gold)
Pt (Platinum)
Ag (Silver)
Pd/Ag (Palladium/Silver)
Pt/Ag (Platinum/Silver)

DIELECTRICS

RESISTOR
0.1 OHM to 100 GIGAOHM

CAPACITOR
to 0.156 microfarads printed on substrate higher values available in SMT or wire bonded chips

INDUCTOR 

to 150 microhenrys printed on substrate higher values available in SMT or wire bonded chips

LINE AND SPACE 3 PROCESSING FEATURES
MULTI-LAYERS
DICING
VIAS
WRAPAROUND
LASER TRIMMING
PLATING
DIE ATTACH

SUBSTRATES

Alumina AL2O3
	91% to 99.6%  (96% typical)
	0.010" to 0.100" thick
	Area up to 6" x 8"
	CO2  Laser processing allows any shape and size.

99.5% Beryllia (BeO)
	Thermal conductivity second only to diamond among electrically insulating materials, dissipating nearly 300 W/mK at room temperature
	0.015" to 0.080" thick (.025, .040 and .060" typical)
	Area up to 4"x 4"

Aluminum Nitride (AlN)
	0.020" to 0.040" thick (.025 and .040" typical)
	Area up to 4.500" x 4.500"
	Conducts heat almost as well as BeO, with lower toxicity

Other substrate materials

QUARTZ
GLASS