THICK FILM CAPABILITIES
CONDUCTORS
Au (Gold)
Pd/Au (Palladium/Gold)
Pt (Platinum)
Ag (Silver)
Pd/Ag (Palladium/Silver)
Pt/Ag (Platinum/Silver)
DIELECTRICS
RESISTOR
0.1 OHM to 100 GIGAOHM
CAPACITOR
to 0.156 microfarads printed on substrate higher values available in SMT or wire bonded chips
INDUCTOR to 150 microhenrys printed on substrate higher values available in SMT or wire bonded chips
LINE AND SPACE 3 PROCESSING FEATURES
MULTI-LAYERS
DICING
VIAS
WRAPAROUND
LASER TRIMMING
PLATING
DIE ATTACH
SUBSTRATES
Alumina AL2O3 |
|
91% to 99.6% (96% typical) |
|
0.010" to 0.100" thick |
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Area up to 6" x 8" |
|
CO2 Laser processing allows any shape and size. |
99.5% Beryllia (BeO) |
|
Thermal conductivity second only to diamond among electrically insulating materials, dissipating nearly 300 W/mK at room temperature |
|
0.015" to 0.080" thick (.025, .040 and .060" typical) |
|
Area up to 4"x 4" |
Aluminum Nitride (AlN) |
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0.020" to 0.040" thick (.025 and .040" typical) |
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Area up to 4.500" x 4.500" |
|
Conducts heat almost as well as BeO, with lower toxicity |
Other substrate materials
QUARTZ
GLASS
|