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Thermal conductivity second only to diamond among electrically insulating materials, dissipating nearly 300 W/mK at room temperature. |
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A thermal coefficient of expansion (TCE) intermediate to silicon or gallium arsenide and metals. |
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Electrical resistivity and dielectric strength equivalent to competitive materials. |
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Low dielectric constant (6.7) and low loss index (.0012 at 1Mhz) permitting improved circuit performance at high frequencies. |
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An inherent stabilizing in oxidizing and reducing high dewpoint atmospheres, unlike nitrides, which will decompose to their oxide equivalent. |