Hybrid technology has proven to be the solution to the growing demand to increase circuit performance while drastically reducing the space required for such performance and improved reliability due to the testing and screening of an entire circuit rather than only the individual components. Functional density, however, is only the most obvious advantage of our power hybrids |
Extensively used in aerospace, space, defense, medical, industrial, commercial, and communications applications.
General |
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Miniaturization - Saving of Space and Weight |
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Fewer and Shorter Interconnections |
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Mixed Technologies |
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Active and Passive Components |
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Discrete and Monolithic Components |
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Improved Thermal Efficiency |
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Incorporation of Power Components with/without Low Power Components |
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Use of High Conductivity Ceramics and Metal Packages for Low Thermal Resistance |
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Integrated Heat Sinking of Components |
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Reduced Inductive Coupling |
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Improved Reliability due to the Testing and Screening of an entire circuit rather than only the individual components |
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Fully Tested "Turn-Key" Solution |
Electrical |
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Operates from DC to 20 GHz (Screened Au) or DC to 80 GHz (Etched Au) |
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Minimum geometries improve high frequency performance |
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Thick film resistors provide excellent thermal tracking |
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Active resistor trimming compensates for component variations |
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0.1% Resistor ratios and absolute values possible |
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High dielectric isolation with increased high frequency response |
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Hybrid substrate combines electrical and mechanical functions |
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Variety of voltages, power levels, frequencies, arrays, etc… |
Mechanical |
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Substantial size and weight reductions |
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Pin-outs and packaging optimized to simplify system integration |
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Increased thermal dissipation and reduced temperature gradients |
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Packaged hybrids are almost indestructible |
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Proprietary packaging precludes reverse engineering of your design |
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Operational over extreme temperature range |
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True integration of semiconductor and passive device technologies |
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Hyb width="20"rids allow minimal inventory, handling and assembly labor |
Economy |
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High reliability minimizes expensive field failures |
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Automation of substrate fabrication and assembly reduces cost |
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Compact circuitry reduces system bulk to increase performance |
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Modest tooling and development expense |
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Functional trimming allows use of wider tolerance components |
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Screen printing offers cost effective resistor fabrication |
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Wide range of available components allows cost effective choices |
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Flexibility in design facilitates changes and modifications |
Purchasing and Production |
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Fewer part drawings |
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Fewer components to purchase |
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Less stock control |
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Reduced assembly time and cost |
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Reduced troubleshooting time |
Quality and Reliability |
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Technological maturity allows reliability optimization in design |
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Ceramic substrates dissipate heat quickly -circuits run cooler |
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Minimal number of solder joints and interconnections |
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Automation optimizes error-free production |
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850 degree C resistor firing insures stability at operating temperature |
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Vendor qualification and incoming inspection maintains standards Adherence to military documentation insures trace ability Less Incoming Inspection Fewer Rejects Supplier Guarantees Interconnects as well as Components Reduced In-Process Inspection Hybrid Circuits have Demonstrated Lower Failure Rate |
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