Advantages of Hybrid Circuits & Typical Applications

Hybrid technology has proven to be the solution to the growing demand to increase circuit performance while drastically reducing the space required for such performance and improved reliability due to the testing and screening of an entire circuit rather than only the individual components. Functional density, however, is only the most obvious advantage of our power hybrids

Advantages of Hybrid Circuits

Extensively used in aerospace, space, defense, medical, industrial, commercial, and communications applications.


Miniaturization - Saving of Space and Weight

Fewer and Shorter Interconnections

Mixed Technologies


Active and Passive Components


Discrete and Monolithic Components

Improved Thermal Efficiency


Incorporation of Power Components with/without Low Power Components


Use of High Conductivity Ceramics and Metal Packages for Low Thermal Resistance


Integrated Heat Sinking of Components

Reduced Inductive Coupling

Improved Reliability due to the Testing and Screening of an entire circuit rather than only the individual components

Fully Tested "Turn-Key" Solution


Operates from DC to 20 GHz (Screened Au) or DC to 80 GHz (Etched Au)

Minimum geometries improve high frequency performance

Thick film resistors provide excellent thermal tracking

Active resistor trimming compensates for component variations

0.1% Resistor ratios and absolute values possible

High dielectric isolation with increased high frequency response

Hybrid substrate combines electrical and mechanical functions

Variety of voltages, power levels, frequencies, arrays, etc…


Substantial size and weight reductions

Pin-outs and packaging optimized to simplify system integration

Increased thermal dissipation and reduced temperature gradients

Packaged hybrids are almost indestructible

Proprietary packaging precludes reverse engineering of your design

Operational over extreme temperature range

True integration of semiconductor and passive device technologies

Hyb width="20"rids allow minimal inventory, handling and assembly labor


High reliability minimizes expensive field failures

Automation of substrate fabrication and assembly reduces cost

Compact circuitry reduces system bulk to increase performance

Modest tooling and development expense

Functional trimming allows use of wider tolerance components

Screen printing offers cost effective resistor fabrication

Wide range of available components allows cost effective choices

Flexibility in design facilitates changes and modifications

Purchasing and Production

Fewer part drawings

Fewer components to purchase

Less stock control

Reduced assembly time and cost

Reduced troubleshooting time

Quality and Reliability

Technological maturity allows reliability optimization in design

Ceramic substrates dissipate heat quickly -circuits run cooler

Minimal number of solder joints and interconnections

Automation optimizes error-free production

850 degree C resistor firing insures stability at operating temperature

Vendor qualification and incoming inspection maintains standards Adherence to military documentation
insures trace ability Less Incoming Inspection Fewer Rejects Supplier Guarantees Interconnects as well
as Components Reduced In-Process Inspection Hybrid Circuits have Demonstrated Lower Failure Rate

Hybrid Circuits: Typical Applications for Military & Industrial Use

Typical Systems


Guidance Systems

Motor Controls


Fire Control


Typical Systems

Linear Voltage Regulators

Current Regulators

Motor Controllers & Drivers

Power Factor Correction Modules


DC to DC Converters

Fire Control


Power Amplifiers

Rectifier Networks (with & without Snubbers)

Supervisory Circuits


Manufacturing From Prototype Thru Production. We Can Meet Your Deadline.